As semiconductor manufacturing advances toward increasingly demanding applications, conventional laser wavelengths can face limitations. At 1980 nm (2 µm), silicon becomes transparent — opening up new possibilities for precision wafer processing.

At SEMICON Europe 2026, you can learn more about our activeTwo-15 laser — an industrial-grade, ultrafast thulium fiber laser designed for silicon processing.

Meet us at SEMICON Europe 2026 | Booth B1.317

Schedule a Meeting

Learn more about the activeTwo-15 & Join the Thuringian Booth Party

By leveraging silicon’s transparency, 2 µm processing enables highly controlled energy deposition while reducing unwanted thermal effects.

The activeTwo-15 combines:

• 1980 nm wavelength for new silicon-processing opportunities
• Sub-400 fs pulses and near-diffraction-limited beam quality (M² < 1.3)
• Pulse-on-demand operation
• Industrial-grade reliability, proven in semiconductor production environments

Join Us for a Booth Party

Beyond the technical discussions, we would also be delighted to meet you in a more informal setting.

On Wednesday, November 11, from 17:30, we invite you to the Thuringian booth (B1.317) for an evening of networking and exchange.

Look forward to traditional Thuringian Bratwurst, and other regional specialties from Thuringia.

If you would like to join us, feel free to reach out in advance so we can reserve a spot for you.

Join the Booth Party

Let’s Talk 2µm in Munich

Whether you are working on advanced packaging, wafer processing, bonding technologies, or future semiconductor manufacturing concepts, we would be happy to discuss how 2 µm laser technology can support you.

Visit Us

• SEMICON Europe 2026 | Munich
• Hall B1 | Booth 317
• 10 – 13 November 2026

We look forward to meeting you in Munich.